silicon technical terms-4
Site -An area on the front surface of the wafer that has sides parallel and perpendicular to the primary orientation flat.
Site Array - a neighboring set of sites
Site Flatness -
Slip - A defect pattern of small ridges found on the surface of the wafer.
Smudge - A defect or contamination found on the wafer caused by fingerprints.
Striation - Defects or contaminations found in the shape of a helix.
Subsite, of a Site -An area found within the site, also rectangular. The center of the subsite must be located within the original site.
Surface Texture -Variations found on the real surface of the wafer that deviate from the reference surface.
Test Wafer - A silicon wafer that is used in manufacturing for monitoring and testing purposes.
Thickness of Top Silicon Film -The distance found between the face of the top silicon film and the surface of the oxide layer.
Top Silicon Film -The layer of silicon on which semiconductor devices are placed. This is located on top of the insulating layer.
Total Indicator Reading (TIR) - The smallest distance between planes on the surface of the wafer.
Virgin Test Wafer - A wafer that has not been used in manufacturing or other processes.
Void - The lack of any sort of bond (particularly a chemical bond) at the site of bonding.
Waves - Curves and contours found on the surface of the wafer that can be seen by the naked eye.
Waviness - Widely spaced imperfections on the surface of a wafer.


